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ENGR SR, PACKAGE DEVELOPMENT_TL (NPI)

Onsemi

Seremban, Negeri Sembilan, Malaysia Full time June 04, 2026
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Opportunity Description

onsemi is currently seeking a skilled and driven NPI Engineer – Soldering Process, Diebond and Wirebond to lead the introduction and optimization of soldering processes for new product lines in a high-tech manufacturing environment. This role is essential in ensuring robust process integration, high-yield production, and seamless transition from development to manufacturing. The position reports to the Director, New Product Engineering.

  • Leads the development and implementation of soldering, diebond and wirebond processes for new product introductions (NPI).
  • Collaborate with R&D, Process Engineering, and Manufacturing teams to ensure soldering diebond and wirebond processes meet design and reliability requirements.
  • Defines process parameters, control plans, and qualification strategies for soldering diebond and wirebondoperations.
  • Conducts DFM (Design for Manufacturability) reviews with a focus on solder/ wire joint integrity and thermal prof...
    • Full time Engineers

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    Opportunity Details

    Location Seremban, Negeri Sembilan
    Country Malaysia
    Type Full time
    Category Engineers
    Posted June 04, 2026
    Deadline July 14, 2026

    About Onsemi

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    Onsemi

    Seremban, Malaysia

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