Opportunity Description
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations.
**Key Responsibilities**
+ Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS,...
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations.
**Key Responsibilities**
+ Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS,...
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