Intern- Backend Assembly Encapsulation Equipment

Intern- Backend Assembly Encapsulation Equipment

1d ago , from MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Encap 160’s 3‑Step Air Vent Implementation

Description

Implement and qualify a 3‑step air vent design for Encap 160 to improve air vent performance, reduce void and bleed risks, and support recurring flash‑controlled encapsulation. The project covers build validation, qualification tracking, and multi‑functional alignment through full implementation readiness.

Scope

• Support design validation and qualification of the 3‑step air vent implementation
• Compile and compare current vs modified 3‑step air vent designs
• Support DOE and boundary studies, including: Air shot, Bleeding evaluation, Void verification, and Vent clog evidence
• Track and document key design parameters: Vent depth and sequence, Filler size interaction, Film thickness vs vent opening conflict
• Manage qualification ...