Opportunity Description
Job Description1. New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops
2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development
3. Common strip format unification management
4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )
5. PCB technology development and DRM ownerRequirement1. New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops
2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development
3. Common strip format unification management
4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )
5. PCB technology development and DRM owner
2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development
3. Common strip format unification management
4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )
5. PCB technology development and DRM ownerRequirement1. New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops
2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development
3. Common strip format unification management
4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )
5. PCB technology development and DRM owner
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