Bonder Applications Engineer - 50%+ Travel, Growth

A leading semiconductor company in Singapore is seeking an experienced engineer responsible for providing application support on bonder tools and executing projects related to lithography. Candidates should possess a degree in Engineering or Science, with a minimum of 5 years' experience in the wafer process engineering field. The role demands a self-driven, detail-oriented person ready to work independently and tackle challenges in a dynamic environment. Benefits include performance bonuses and professional development support.
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