Opportunity Description
Chip Packaging Architect
_corporate_fare_ Google _place_ Sunnyvale, CA, USA
**Advanced**
Experience owning outcomes and decision making, solving ambiguous problems and influencing stakeholders; deep expertise in domain.
**Minimum qualifications:**
+ Bachelor's degree in Electrical/Computer Engineering, Computer Science, a related technical field, or equivalent practical experience.
+ 10 years of experience in advanced packaging technology and high-volume production development.
+ Experience with optical sub-assemblies, including CPO, silicon photonics, VCSELs, and micro-LED integration.
**Preferred qualifications:**
+ Experience translating technical product requirements into packaging specifications.
+ Experience working within assembly houses or wafer foundries.
+ Knowledge of 2.5D/3D/3.5D heterogeneous integration (interposers, TSVs, RDL, micro-bumping, high-density substrates).
+ Understanding of end-to-e...
_corporate_fare_ Google _place_ Sunnyvale, CA, USA
**Advanced**
Experience owning outcomes and decision making, solving ambiguous problems and influencing stakeholders; deep expertise in domain.
**Minimum qualifications:**
+ Bachelor's degree in Electrical/Computer Engineering, Computer Science, a related technical field, or equivalent practical experience.
+ 10 years of experience in advanced packaging technology and high-volume production development.
+ Experience with optical sub-assemblies, including CPO, silicon photonics, VCSELs, and micro-LED integration.
**Preferred qualifications:**
+ Experience translating technical product requirements into packaging specifications.
+ Experience working within assembly houses or wafer foundries.
+ Knowledge of 2.5D/3D/3.5D heterogeneous integration (interposers, TSVs, RDL, micro-bumping, high-density substrates).
+ Understanding of end-to-e...
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