Design Engineering Intern

Qorvo

Osaka, Osaka, Japan Temp (Payroll) June 03, 2026

Opportunity Description

Responsibilities

Producing and implementing designs to meet customer specifications for:

Low cost and thermally efficient package platforms

LTE, carrier aggregation, multiple antennas, filters, and power management

Ruggedness, ESD, and quality

Meeting performance requirements while also considering size, cost, footprint, and schedule

Working with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data

Partnering with technicians to perform circuit simulations and testing as needed

Designing, testing, and tuning of RF PAs

Developing and executing test plans for electronics package mechanical robustness

Developing application guidelines for package assembly into next level assembly

Creating basic algorithms for automating FEA model generation

Potential to work with:

Sig...

Temp (Payroll) Engineers

Submit your application for Design Engineering Intern at Qorvo

Location Osaka, Osaka

Country Japan

Type Temp (Payroll)

Category Engineers

Posted June 03, 2026

Deadline July 13, 2026