Device Packaging & Test Engineering Lead (Asia)

A technology company based in Singapore is seeking an experienced engineering lead to oversee device packaging and test engineering. The ideal candidate should possess at least 12 years of experience and a bachelor's degree in Electrical Engineering or a related field. Responsibilities include leading an operation team, conducting wafer probe tests, and improving packaging processes. The role offers a competitive salary, equity, and a collaborative work environment focused on cutting-edge technologies.
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