Opportunity Description
Job Description1. Develop and evaluate the advanced IC Package technology.
2. Collaborate with the assembly subcontractors to complete the technology development.
3. Qualification and yield improvement for the advanced IC Packages.
4. Audit subcontractors.Requirement1. MS degree (or above) in Science or Engineering.
2. In depth understanding of IC package technology, cost structure, manufacturing, material, process.
3. Familiar/experienced with advanced IC package development, especially in bumping/Fan-out/WLCSP/2.5D/3D/CPO related packages.
4. Understanding of different kinds of package structures, such as PBGA/TFBGA/FlipChip/POP/PiP/SiP/InFO/CoWoS.
2. Collaborate with the assembly subcontractors to complete the technology development.
3. Qualification and yield improvement for the advanced IC Packages.
4. Audit subcontractors.Requirement1. MS degree (or above) in Science or Engineering.
2. In depth understanding of IC package technology, cost structure, manufacturing, material, process.
3. Familiar/experienced with advanced IC package development, especially in bumping/Fan-out/WLCSP/2.5D/3D/CPO related packages.
4. Understanding of different kinds of package structures, such as PBGA/TFBGA/FlipChip/POP/PiP/SiP/InFO/CoWoS.
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