Intern - Process Engineer

Micron MSB is seeking a passionate and driven intern to join our Assembly Process Engineering team. This internship offers hands‑on exposure to advanced semiconductor packaging processes, with a focus on Flip Chip Attach and Underfill technologies.

• Setup, execute, and analyze Flip Chip Attach and Underfill process experiments.
• Collaborate with cross‑functional teams to troubleshoot and resolve process issues and work on engineering projects.
• Apply statistical methods to analyze process data and identify trends or anomalies.
• Explore AI‑based approaches for predictive modeling and process optimization.

• A final presentation summarizing key learnings, challenges, and recommendations.
• Contribution to at least one yield improvement or defect reduction initiative.
• Development of a simple AI model or script to support process monitoring or defect prediction.