Lead Packaging Engineer for InFO/Chiplet 3D IC Assemblies

Advanced Micro Devices in Penang, Malaysia is looking for a skilled packaging engineer to drive readiness for new products and enhance operational capabilities. The candidate will collaborate with internal teams and strategic suppliers, ensuring quality and productivity improvements.

Applicants should hold a degree in engineering with over 7 years of experience in the semiconductor field. Strong project management and communication skills are essential for success in this dynamic role.