Packaging Process Engineer – RF & High-Frequency

A leading technology firm in Sedgefield, South Africa is looking for an experienced Process Engineer (Packaging & Assembly) to establish and lead a robust packaging capability. This strategic and hands-on role demands deep expertise in semiconductor packaging and the creation of scalable systems for high reliability production. Key responsibilities include defining packaging architecture and optimizing processes. Candidates should have a relevant degree and experience with industry standards, along with strong problem-solving and communication skills.
#J-18808-Ljbffr