Opportunity Description
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What
Where
Probe Card Technician (Perm) Up to 3,500- Singapore's Leading Precision manufacturing equipment manufacturer
The Client
A Singapore-based clean energy company focused on high-precision manufacturing site producing micro-connectivity solutions
Job Duties
- Operate wire bonding machines (ball bond / wedge bond) for semiconductor device assembly
- Set up bonding parameters such as temperature, force, ultrasonic power, and bonding time
- Perform machine conversion, recipe setup, and product changeover
- Inspect wire bonds using microscope to ensure bond quality and reliability
- Conduct pull test and shear test to verify bonding strength and compliance with specifications
- Troubleshoot bonding defects such as non-stick on pad (NSOP), wire sweep, lifts...
Ready to Apply?
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