Principal Advanced Packaging Architect for HPC/AI Chips

A leading technology company in Singapore seeks a Staff / Principal Advanced Packaging Engineer to lead advanced packaging architecture and strategy for HPC and AI silicon. This high-impact role requires experience in semiconductor packaging and managing cross-functional teams. Ideal candidates will have a strong background in FCBGA and proven ability in high-volume production, overseeing technical governance while driving innovative solutions in a rapidly evolving environment.
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