Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)

• Design compact mechanical housing to operate under 250°C ambient conditions.
• Ensure internal core temperature remains under 55°C during runtime.
• Select and integrate miniaturized components (compute, battery, sensors).
• Strip sensor casings and reassemble into a custom mount with thermal shielding.
• Perform heat simulation, thermal insulation, and shock‑resistance design.
• Test hardware in specified sites and environments.

• Bachelor or Master in Mechanical Engineering, Mechatronics, or similar.
• Strong experience in heat‑resistant enclosure design and miniaturized hardware integration.
• Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.).
• Experience with IP65/IP67 standards, fanless computing, and embedded design.
• Knowledge of fire‑fighting robot or harsh‑environment robotic platforms is a plus.

Centre for A...