Opportunity Description
Position title : Senior Advanced Packaging Process Engineering ( TCB / HBM / CoWoS / 2.5D / 3D packaging )
- Location: Admiralty
- Working Days: 5 Day A Week
- Working hours : 9:00am - 6:00pm
- Salary :SGD 7,000 – SGD 10,000/month (Based on experience)
- Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
- Support technical sales activities and customer discussions.
- Benchmark competitor equipment and identify technology gaps.
- Translate customer requirements into internal equipment specifications.
- Develop and optimize TCB process parameters on TCB Equipments.
- Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
- Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination an...
Ready to Apply?
Submit your application for Senior Advanced Packaging Process Engineering [ TCB / HBM / CoWoS / 2.5D / 3D packaging ] - 8890 at THE SUPREME HR ADVISORY PTE. LTD.
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