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Senior Engineer, Packaging Engineering (Thermal Design)

Sandisk

Batu Kawan, Penang, Malaysia full-time June 04, 2026
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Opportunity Description

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level.
  • The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques.
  • The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

Qualifications

REQUIRED:

  • B.S. in Mechanical Engineering plus 5 years, of relevant industry experience
  • Solid knowledge through academic coursework or experience required in Mechanical design
  • Proficiency in CAD software (e.g. SolidWorks, Autocad)
  • Knowledge of engineering drafting stand...
full-time Engineers

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