Senior Failure Analysis Engineer (IC & Package)

Infineon Technologies AG in Kulim, Malaysia is looking for a professional in IC Failure Analysis. The job entails performing functional failure analysis on both wafer and package levels, requiring a strong understanding of electrical verification and problem-solving skills.

Candidates should have an engineering degree (Bachelor's, Master's, or PhD) and be skilled in advanced failure verification methods. Additional responsibilities include preparing failure analysis reports and achieving efficiency KPIs.