Opportunity Description
Key Responsibilities
- Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products.
- Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure.
- Drive yield breakthroughs by understanding the end‑to‑end test flow, product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements.
- Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs.
- Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification.
- Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, P...
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