Senior IC Substrate Engineer, NPI & Manufacturing Lead

Broadcom Inc. is seeking an experienced engineer to manage IC substrate manufacturing issues, lead product innovation, and drive process improvements. This role entails collaborating across various engineering teams to enhance packaging technology in high-volume production.

The ideal candidate possesses over 8 years of relevant experience and a bachelor’s degree in engineering, with fluency in Mandarin and strong leadership capabilities. Opportunities to travel across Asia to support manufacturing locations may arise.