Senior Lead Frame & Packaging Materials Engineer

Infineon Technologies AG is looking for a Technical Expert in Lead Frame and Packing Material Development in Malacca City, Malaysia. The role involves driving design and specification initiatives while ensuring compliance with manufacturing, quality, and cost requirements.

Applicants should have a Bachelor’s Degree in Engineering, with a minimum of 8 years of relevant experience, especially in semiconductor assembly and packaging development. Knowledge in material physics and AutoCAD skills are essential.