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Senior Package Architect & R&D Leader

Nexperia

seremban, negeri sembilan, Malaysia Full-time May 30, 2026
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Opportunity Description

Nexperia is seeking a highly skilled individual to join their Semiconductor Packaging team in Seremban, Malaysia. The role requires a Master's or PhD degree in a relevant field and entails responsibilities such as leading technical projects, collaborating with a multi-cultural team, and providing technical support. Nexperia emphasizes career growth and offers a permanent contract with competitive pay and benefits. Join a dynamic environment that fosters innovation and personal development.
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Full-time Engineering

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