Senior Package Tech Lead – Automotive NPI & Design

Infineon Technologies AG is seeking a skilled professional for Package Design and Development in Penang, Malaysia. The role focuses on designing WB BGA, QFP, and VQFN package technologies that ensure optimal performance and manufacturability.

The ideal candidate will have over 8 years of experience, a relevant degree, and good knowledge of Back End processes and Automotive quality standards. This position involves leading technical initiatives and collaborating with partners on project management.