Senior Packaging Thermal Engineer (CFD & PCBA)

Sandisk is looking for a Packaging Engineer in Batu Kawan, Malaysia. You will work in the Packaging R&D group, focusing on thermal designs for semiconductor packaging and flash product assembly.

The ideal candidate needs a B.S. in Mechanical Engineering and 5 years of relevant industry experience, with a strong background in mechanical design and proficiency in CAD software like SolidWorks and Autocad. The position emphasizes teamwork and the ability to meet product release schedules.