Opportunity Description
工作內容
- Participate in design‑for‑test analysis at IC design cycle including testability feedback and test plan definitions.
- Responsible for providing wafer/package test solutions per IC’s test requirement, including defining standard/customized test platform architecture, designing wafer probe card / package test board, integrating test hardware and developing associated test methodologies.
- Develop, integrate and optimize test programs for IC’s design validation, characterization and manufacturing release.
- Work with manufacturing support team in qualifying production test programs with attention to key performance indices including test coverage, test cost and yield.
- Conduct root‑cause analysis of early customer returns and develop solutions by improving test coverage in test programs or test hardware.
- Collaborate with vendors to build production auto‑test handlers or test fixtures.
相關條件
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