Thermosonic Wirebond Process Engineer Lead

onsemi is seeking a Wire Bond Process Engineer in Lapu-Lapu, Philippines, to optimize thermosonic wire bond processes. The role involves defining parameters, troubleshooting quality issues, and collaborating across various teams to ensure high product quality and yield. The ideal candidate has over 10 years of experience in semiconductor manufacturing and a strong background in wire bonding, with expertise in bond metallurgy and statistical process control. This position also requires proficiency in managing tooling and adherence to compliance standards.
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