Lead Solutions Engineer: SI/PI/Thermal Analysis

Work in a team environment creating and implementing 3DIC reference flows and designs.

The candidate is expected to be anhave advanced knowledge of advanced packaging signal and power integrity analysis tools and flows. 

Use Sigrity, Clarity and Celcius and multiple 3DIC configurations to help customers with strong problem-solving skills.

Knowledge of the CMOS sign-off design flow a plus.

Complete Bachelor’s degree in Electrical or Electronics Engineering

Experience with package design and Cadence SI/PI/Thermal tools

Strong knowledge of advanced packaging concepts

Strong knowledge of 2.5D, 3DIC and stacked die technologies

Strong personal drive for continuous learning and expanding professional skill sets

Excellent verbal and written communication skills in English and Portuguese.