Opportunity Description
Job Details
Seeking a highly motivated, self-driven individual in ATD‑Asia with strong technical background and ability to collaborate well across multi‑functional teams driving materials technology development in packaging.
- Candidate will be responsible for leading efforts to develop, integrate, and certify materials in support of assembly packaging development and HVM readiness for Intel's Packaging Technologies.
- Candidate will be expected to communicate and influence materials and supplier directions, strategies, and decisions.
- The candidate should have a solid understanding of the fundamentals of materials (polymers, metals, solders, composites, etc.), physical and mechanical properties, structure‑property‑processing relationships, analytical tools and characterization techniques, mechanical behavior and modeling, thermodynamics and kinetics, and phase transformations.
- Candidate must be able to apply sound technical proble...
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