Package Design Engineer

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

Job Description

Package Design Engineer – location: Saint‑Egrève (near Grenoble, France) or Teledyne Anafocus in Seville (Spain). The role leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications, defining the solution, and ensuring successful routing and design reviews.

Responsibilities

• Manage the full design flow of organic and ceramic multi‑layers microelectronics packaging (BGA, PGA, CLCC, CQFP, WLCSP).
• Identify customers’ needs and devise a solu...