Package-Silicon Integration Engineer (Early Career)

Micron Technology, Inc. is looking for an Engineer in Package-Silicon Integration in Singapore. This role supports NAND package and silicon integration for next-generation memory products, providing early-career engineers with structured exposure to semiconductor packaging and integration risks.

Responsibilities include assisting with chip-package interaction assessments and collaborating with cross-functional teams. Candidates should have a Bachelor's or Master's degree in Engineering, with less than 2 years of experience.

The position offers mentoring, guidance, and an opportunity to build foundational technical skills while contributing to team objectives.