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Principal Engineer-Package Design

Johnson Electric

Jiangmen, Guangdong, China Full time June 12, 2026
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Opportunity Description

Key Responsibilities

  • Package Design & Development:Lead the design and development of new MOSFET packages, especially for lead frame based (e.g. DFN).Lead frame and clip frame design experience is preferred.Create detailed package models using 3D CAD software and define all critical dimensions, material stack-ups, and assembly drawings.Optimize package designs for superior electrical performance (low RDS(on), low parasitic inductance/capacitance), thermal performance (low RthJC), and mechanical robustness.
  • Simulation & Analysis:Perform multi-physics simulations, including thermal (e.g., Ansys Icepak, SolidWorks Simulation), electrical (e.g., Q3D Extractor, HFSS), and mechanical stress analysis to predict and validate package performance.Analyze simulation results to identify design trade-offs and drive design improvements.Correlate simulation models with empirical data from lab characterization to ensure accuracy.
  • Material Selection & Qu...
    • Full time Engineers

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    Opportunity Details

    Location Jiangmen, Guangdong
    Country China
    Type Full time
    Category Engineers
    Posted June 12, 2026
    Deadline July 22, 2026

    About Johnson Electric

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    Johnson Electric

    Jiangmen, China

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