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Principal Package Design Engineer – R&D (Discrete / Power)

Nexperia

Seremban, Negeri Sembilan, Malaysia Full time June 02, 2026
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Opportunity Description

We are looking for a Principal Package Design Engineer to support new semiconductor package development and continuous design improvement, primarily focusing on discrete packages. This role plays a key part in New Product Introduction (NPI) as well as mass production, ensuring robust, manufacturable, and cost-effective package designs. You will collaborate closely with package architects and cross-functional engineering teams to deliver high-quality assembly designs aligned with industry and internal standards.

What You Will Do

  • Lead and support lead frame package design for NPI and mass production phases, ensuring alignment with functional and manufacturing requirements

  • Work closely with Package Architects to develop technical assembly drawings

  • Define and finalize dimensions and tolerances based on assembly capability, package technology, and lead frame fabrication design rules

  • Ensure compliance with industry standa...

  • Full time Engineers

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