Opportunity Description
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D bump process engineer to become part of our Quantum Advanced Packaging team. This role will entail driving next-generation interconnect scaling development efforts in our Advanced Packaging and Photonics Center (APPC) as well as with our partners. The primary responsibility of this position is to own development and integration of cryogenic, superconducting bumping processes enabling scalable quantum hardware packaging.
About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Job Summary
About GlobalFoundries
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Job Summary
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