Opportunity Description
Responsibilities
Lead local Hybrid Bonding equipment full-cycle R&D, architecture design, technical breakthrough and iteration.
Connect with local & Southeast Asian OSAT/wafer fabs, match HBM, Chiplet, 3D stacking process demands, deliver technical solutions.
Oversee precision mechanism, nano alignment, motion control, vacuum & temp-pressure control, electrical and software system integration & debugging.
Complete prototype tuning, accuracy optimization, yield improvement and customer acceptance, resolve mass production technical issues.
Manage local R&D team, formulate R&D standards, coordinate local supply chain to realize localized mass production.
Track frontier industry technology, carry out technical pre-research and patent layout to boost business commercialization.
Requirements
Bachelor or above, major in Mechanics, Automation, Microelectronics, Semiconductor Equipment etc., Master...
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