Resident Packaging Engineer: Yield, RTM & Process Control

Power Integrations in Penang is hiring a hands-on Resident Package Engineer to support mass production of multi-die wirebond leadframe packages. This role focuses on sustaining manufacturing performance and implementing robust release-to-manufacturing protocols.

Candidates should possess a B.S. in engineering with at least 2 years in semiconductor back-end assembly. Strong knowledge of wirebond processes is essential. Excellent communication skills are required, with the role based full-time at the OSAT site.