Semiconductor Packaging - Flip Chip Bonding Technical Sales Engineer - YZ11

Position title : Semiconductor Packaging - Flip Chip Bonding Technical Sales Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 7,000 - SGD 10,000/month (Based on experience and technical capability). Responsibilities: Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges. Support technical sales activities and customer discussions. Benchmark competitor equipment and identify technology gaps. Translate customer requirements into internal equipment specifications. Develop and optimize TCB process parameters on TCB Equipments. Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration. Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage. Conduct DOE and process characterization activities. Work closely with Mechanical, Software, Electrical, Motion and Vis...