Opportunity Description
About the role:
If you are passionate about pushing technical boundaries while leading teams to deliver real impact in the field, this is your opportunity to make it happen.
We are looking for a driven Die Bond Product Engineering Manager to lead the next generation of die attach technology, shaping how our equipment performs in real customer applications. In this role, you will own the intersection of machine innovation, process expertise, and customer success, turning complex semiconductor requirements into cutting‑edge, high‑performance solutions.
What You will Be Doing:
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