Opportunity Description
Renesas Electronics Corporation is currently seeking a qualified professional to enhance wire bonding equipment performance in Bayan Lepas, Malaysia. The role encompasses responsibilities like improving equipment effectiveness, minimizing downtime, and planning maintenance strategies.
The ideal candidate should possess a Bachelor's degree in engineering and have at least 6 years of semiconductor equipment maintenance experience. Skills in troubleshooting and leadership are essential.
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Submit your application for Senior Wire Bond Equipment Engineer (OEE & Reliability) at Renesas Electronics Corporation
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