SMTS - 3D Heterogeneous Integration (all things TSV)

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit Summary Of Role GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive TSV/TOV and post-processing (reveal, thinning, RDL, etc.) development efforts. Essential Responsibilities: Lead 3DHI process development efforts for the building blocks ('all things TSV/TOV') required for advanced packaging solutions needed in the product lines and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor ...