Q

Sr Mgr, Bump/DPS & Assembly Engineering

Qorvo

Singapore, Singapore, Singapore Regular June 05, 2026
Apply Now

Opportunity Description

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit to learn how our innovative team is helping connect, protect and power our planet.

RESPONSIBILITIES / ACCOUNTABILITIES:

  • Early engagement & execution of a Packaging Technology development working with OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs

  • Could Manage multiple projects for package development from risk assessment, process /BOM establishment, qualification.

  • Lead and Manage OSAT New Technology and New P...
  • Regular Engineers

    Ready to Apply?

    Submit your application for Sr Mgr, Bump/DPS & Assembly Engineering at Qorvo

    Apply for this Position