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Staff Package Design Engineer

Renesas Electronics

Bayan Lepas, Penang, Malaysia full-time June 30, 2026
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Opportunity Description

Job Description

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

  • Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
  • Ramp up manufacturing volume and qualify required sources.
  • Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
  • Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
  • Manage Product Lifecycle Management documents to the latest status.
  • Conduct change-management with suppliers to sustain / improve capacity and cost. 

Qualifications

  • Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
  • Experienced in process engineering...
full-time Engineers

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