Thermosonic Wire Bond Process Engineer – Lead Yields

onsemi is seeking a Wire Bond Process Engineer to own and optimize the thermosonic wire bond process in Davao City, Philippines. Ideal candidates should have over 10 years of semiconductor manufacturing experience, with at least 5 years focused on thermosonic wire bonding. Responsibilities include defining key bonding parameters, leading problem-solving efforts, and ensuring compliance with process management standards. A BS degree in Engineering is required. Join onsemi in driving innovations for a better future.
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