Ultrasonic Wire Bond Engineer: Process, Yield & Quality

Onsemi in Lapu-Lapu, Philippines is seeking an Ultrasonic Wire Bond Process Engineer to optimize and sustain ultrasonic wire bonding processes. This position demands at least 3 years of experience in semiconductor manufacturing, with a focus on wire bonding. Responsibilities include managing bonding tools, leading process improvements, and supporting volume manufacturing. A Bachelor’s degree in Engineering is required, alongside excellent problem solving and communication skills. Join a dynamic team in a fast-paced manufacturing environment.
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