Opportunity Description
TTM Technologies, Inc. – Publicly Traded US Company, NASDAQ (TTMI) – Top-5 Global Printed Circuit Board Manufacturer
About TTM
TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market.
Scope: A Via Fill Operator will operate via fill and planarization equipment to create a superior bond between copper and increase functionality within core surfaces. A Via Fill Operator will also perform all necessary quality and process checks, daily housekeeping and minor preventative maintenance.
Duties and Responsibilities:
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